
Metal-Coated Particle Capabilities
The Metal Coated Particles division of Federal Technology Group supplies, processes and manufactures a large variety of MCPs, including those tailored to meet individual customer requests. We have the ability to produce MCPs with custom volume settings and weight percentages. Production processes include:
Water-Based Systems
MCP technology is a water-based solution coating technology (including electroplating, electroless plating and others) which puts a uniform and continuous metal coating on each individual substrate particle. Substrate materials that can be coated include metals, ceramics, graphite, diamond and polymers.
Electroplating
The Metal Coated Particles division of Federal Technology Group has developed a unique process of encapsulation through electroplating. Electroplating is known to be the lowest-cost process for depositing metal coatings on substrate materials. The electroplating process developed for fabrication of certain encapsulated materials has a much shorter production period and mass production capability compared to the hot isostatic pressing (HIP) process for similar materials. Using a precise combination of materials will result in higher thermal conductivity and excellent solderability.
With the right materials, the Metal Coated Particles division of Federal Technology Group can use this process to develop new materials that demonstrate thermal conductivity measurements higher than 1,500 w/mK. These properties make our encapsulated materials a low-cost and high-performance thermal management solution for various applications.
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